• CEO Pekka Väyrynen pekka.vayrynen(at)hytechcomp.com +358 50 555 1516
• CEO Urmo Sisask Tallinna urmo.sisask(at)hytechcomp.com +372 50 30405
• Business Unit Manager Marko Kiviniemi Electronics marko.kiviniemi(at)hytechcomp.com +358 45 7730 5623
• Business Unit Manager Olli Lindeberg Electromechanics olli.lindeberg(at)hytechcomp.com +358 50 524 5416
• Production Manager Vesa Leppänen vesa.leppanen(at)hytechcomp.com +358 40 451 1763

Muut toimipisteet
Kalmari tee 12
Karla küla, Rae vald
Harjumaa 75327, Tallinna

Vuonna 1989 perustettu HY-Tech Comp (ent. Hyrles) panostaa kokonaissopimusvalmistukseen, jossa kaikki keskeiset työvaiheet tehdään itse. Joustavat tuotantotilat, ajan tasalla oleva laitekanta sekä osaaminen kattavat levylävistyksen, särmäyksen, hitsauksen, jauhemaalauksen, ESD-suojatun sähkömekaanisen kokoonpanon sekä kokonaisvaltaisen elektroniikkatuotannon.

Keywords:

• Manufacturing methods
  • Joining/Assembly
    • Automatic/Robot Assembly
    • Glueing
    • Riveting
    • Clinching
    • Folding
    • Filling/packing
  • Metallic materials, cutting of
    • Laser cutting
  • Metallic materials, cutting, pressing, punching
    • Cutting
    • Splitting
    • Expanded metal manufacuring
    • Nibbling
    • Perforating
  • Metallic materials, surface treatment of
    • Powder coating
    • Screen printing
  • Metallic materials, plastic deformation of
    • Roll threading
    • Edge bending
  • Plastics & rubber, machining of
    • Assembling
    • Laser cutting
    • Glueing
    • Stamping
  • Metallic materials, other machining of
    • Brushing/Blasting
    • Polishing
  • Electric and electronics production
    • Printed board manufacturing
    • X-ray inspection
• Products and components
  • Electro-mechanics
  • Electronics
  • Steel components
• Design & Development
  • CAD, CAM, Documentation
    • CAD
    • CAE
    • CAM
  • Methods, Analysis, Verifying
    • DFA/DFM Design for Assembly & Manufacture
• Other services and products
  • Motherboards assembly
  • Wiring
  • Assembly
    • Electronics assembly
    • System configuration
    • Cable and connector assembly
    • Device assembly
    • Mechanical assembly
  • Component mounting
    • Circuit board assembly
    • SMD component mounting
    • SMT component mounting
  • Laser cutting
  • Painting
    • Powder coating
  • Measurement and testing services
  • Sheet metal work
  • Surface mount technology
  • Manufacturing
    • Label, shield and front panel manufacturing
    • Manufacture of wire harnesses
    • Mechanics manufacturing
    • Manufacture of prototypes
    • Contract manufacturing
    • Label, shield and front panel manufacturing